AIST has succeeded in forming wiring and electrodes for crystalline silicon solar cells by applying a low-damage print manufacturing technology that uses the copper paste for low temperature process developed by Napra Co., Ltd. The copper paste was fabricated by mixing copper powder and low-melting-point alloy particles. Use of the paste enables low-temperature sintering. AIST has realized the technology for high-productivity low-damage print manufacturing using the screen-printing low-temperature-sintering method. These technologies enable low-cost print manufacturing of electrodes and wiring for crystalline silicon solar cells, while satisfying the needs for low-temperature, low-heat-damage processing (<200 °C), low resistance (3×10
–5 Ω·cm), low contact resistance (5.3×10
–4 Ω·cm
2), high peel strength, and high stability. These technologies can be applied to the formation of wiring and electrodes for various cell structures, including flexible displays and sensors.
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