Vol.1 No.2 2008

59/85

Research paper : The aerosol deposition method (J. Akedo et al.)−128 Synthesiology - English edition Vol.1 No.2 (2008) hoop material. This construction allowed exchanging the molding parts and selection of several kinds of combinations for manufacturing of scanners with different resonance frequency and different mirror size for relatively low cost production. Prototypes for process unit for small heating processing device and ink jet device for wiring were also created, and we were able to construct a system that enabled manufacturing from material to device. Currently, several revisions and improvements are necessary before the unit can be used for practical manufacturing, but we believe there is an advantage in simultaneous optimization and evolution of manufacturing facility development and device design.The metal based optical scanner discussed in the previous section was optimally designed and created by trial-and-error using the prototype production system and computer simulation. As a result, production speed of 1 device/min per line has been achieved. This means that a production level of about 20 ~ 30,000 units per month can be easily obtained. By replacing the conventional Si microfabrication facility manufacturing process with the one described above, great reduction of energy consumption, facility surface area and manufacturing time has been confirmed and the reduction in environment load became possible, as shown in Table 1.5 Summary and future prospectMaximizing the characteristics of the AD method, we investigated the construction of on-demand manufacturing technology with low environmental load that realizes both high product performance and cost reduction. The AD method is making possible coating at room temperature, has a high coating speed, and allows localized coating of functional materials without the need for etching to achieve the desired pattern. In the investigation of manufacturing of electrostatic chuck and optical scanner, simplification of device structure and manufacturing process, improvement of process tact time, and simplification of process device worked effectively. By reviewing the device design from material level, improved function, cost reduction, and decreased environment load were realized in the manufacturing process. Moreover, increase in as mass production device was obtained, and simultaneous optimization of manufacturing facility development and device design can be achieved. This is an example of the vision of “minimal manufacturing” with least input (resource and energy consumption) yet with high practicality (high productivity, low cost) and maximum function (new function, high performance). Of course, MEMS device used as example here cannot be effectively optimized by introduction of the AD method alone, but large-scale optimization (minimization) is possible for wider use if there are further advances in currently known elemental processes.In the future, we will continue the investigation of the effect of introducing new processes, while reconsidering the manufacturing process from the material to device levels.Table 1. Comparison of MEMS manufacturing systems.Floor areaElectrical power (kWh/year)Manufacturing timeEnvironmental loadSilicon lithography MEMS factoryOn-demand factory300 m2 (1000 m2 including ancillary facilities)3600008000(1/45)10 m2(1/30~1/100)(1/10~1/1)Hardly necessary (big reduction!)Disposed material such as resistProcess gasCleaning processAbout 12 min/piece(process time/number per wafer)About 1.2 min/piece(10 per batch)Designed target value 1 min/1 pieceReferences[1][2][3][4][5][6][7][8][9]Nikkei Monozukuri: Buhin jissou nimo seru houshiki (Cell method for parts assembly), Nikkei Monozukuri January 2007 Issue, Nikkei BP, 93 (2007) (in Japanese).J. Akedo and M. Levedev: Ceramic thin coating technology using impact consolidation phenomenon of fine particles and ultra fine powders – Low temperature, high speed coating using aerosol deposition method – , Materia, 41(7), 459-466 (2002).J. Akedo: Aerosol deposition of ceramic thick films at room temperature: Densification mechanism of ceramic layers, J. Am. Ceram. Soc., 89 (6), 1834–1839 (2006).New Energy and Industrial Technology Development Organization “Low Temperature Formation and Integration Technology for Nano Level Electronic Ceramics Material” 2nd Project Workshop Lecture Material, NEDO and Manufacturing Science and Technology Center (2007) (in Japanese).New Energy and Industrial Technology Development Organization: FY2004 NEDO Energy Use Rationalization Technology Strategic Development / Leading R&D for Core Technology for Effective Use of Energy “R&D on Energy Rationalization Technology for Ceramic Process Using Impact Bonding” Project Result Report (2005) (in Japanese).M. Bayer: Retinal scanning display - a novel HMD approach to army aviation head and helmet-mounted displays VII, Proc. SPIE 4711, Orlando, Florida, 4557 (2002).N. Asai, R. Matsuda, M. Watanabe, H. Takayama, S. Yamada, A. Mase, M. Shikida, K. Sato, M. Lebedev, and J. Akedo: A novel high resolution optical scanner actuated by aerosol deposition PZT films, Proc. of MEMS 2003, Kyoto, Japan, 247-250 (2003).J. Akedo, M. Lebedev, H. Sato, and J.H. Park: High-speed optical microscanner driven with resonation of lamb waves using Pb(Zr,Ti)O3 thick films formed by aerosol deposition, Jpn. J. Appl. Phys., 44, 7072-7077 (2005).Y. Kawakami and J. Akedo: Annealing effect on 0.5Pb(Ni1/3Nb2/3)O3-0.5Pb(Zr0.3Ti0.7)O3 thick film deposited by aerosol deposition method, Jpn. J. Appl. Phys., 44, 6934-6937 (2005).Received original manuscript January 29, 2008Revisions received March 14, 2008Accepted March 14, 2008(56)−

※このページを正しく表示するにはFlashPlayer9以上が必要です