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Research paper−121 Synthesiology - English edition Vol.1 No.2 (2008) Considering the manufacturing process of advanced devices in the future, demand for high performance by achieving thinning and high integration of oxide electronics material with multiple functions is expected to increase. In the integration process of electronic devices such as MEMS, various R&Ds are conducted using vacuum thin film processes including sputter and CVD methods due to their manufacturing application potential. However, there are surprisingly few cases where thin film technology has reached a practical level through integration of semiconductor parts. This is due to the fact that, as, for example, in the cases of capacitor and filter parts fabrication, the property of material and the cost of production process in device application are at trade-off, and at this point, ingenious utilization of bulk material is more feasible in terms of cost, facility, and energy consumption. Highly pure raw material and ultra vacuum environment are necessary and 1 IntroductionThe circumstances surrounding the manufacturing process of electronic devices and their implementation are rapidly changing due to industrial globalization and concern for environmental overload. Shortening product(ion) cycle and multi-product variable production have become non-negligible issues. Currently, product specifications are rapidly becoming diverse in the market, and this is affecting mounted products such as connectors, sensors, and actuators. Multi-product variable production with extremely short delivery time is now in demand, in contrast to the age of single-product mass production. The demand in the manufacturing industry is changing greatly due to diversification of market requirements. For example, over 1 billion yen investment in manufacturing line is required to mass produce MEMS device starting from the R&D phase, even when existing LSI manufacturing line is used. Usually, long time is needed for product development, and substantial production volume is required to lower the cost through mass production at device level. For these reasons, the business risk for commercialization is considerable even for a major corporation. It is also the basis for the adage: “killer application is necessary to commercialize MEMS.” On the other hand, MEMS devices are considered as parts (components), and flexibility for multi-product variable production is needed when considering practical application. Although only a hypothesis first, this trend is expected to increase as integration level of modular functional parts increases. Demand for multi-product low-volume production develops when black boxing and customization are conducted to control commoditization of product to maintain its competitiveness. To lower cost in such conditions, further evolution of process technology from perspective of manufacturing will become necessary.- For production of high performance micro devices with low cost and low energy consumption -Jun Akedo* , Shizuka Nakano, Jaehyuk Park, So Baba and Kiwamu AshidaMetrology Institute of Japan, AIST Tsukuba Central 3, Tsukuba, Ibaraki 305-8563, Japan *E-mail : AD (aerosol deposition) method is one of newly developed technologies for spray coating powder materials. It is a revolutionary coating technology in which high-density consolidation of ceramic powder can be obtained at room temperature, without sintering at high temperature as in conventional ceramic formation. By using AD, it is expected to improve device performance, to greatly reduce energy consumption and to decrease the number of steps during fabrication process that ultimately result in cutting production costs. How the characteristics of AD method are positioned from the perspective of technological competitiveness and reduction of environment load, as well as its potential, is investigated from the viewpoint of Full Research, along with description of principles and specific case studies.The aerosol deposition methodKeywords : Aerosol deposition, AD method, optical scanner, on-demand, energy conservation, electronic ceramics, piezoelectric, MEMSFig. 1 Basic components of aerosol deposition (AD) device.[Translation from Synthesiology, Vol.1, No.2, p.130-138 (2008)]Particle beam concentration detector (transmission optical sensor)XYZθ stageMechanical boosterMass flow controllerAerosol generatorRaw powderCrushing and sorting deviceRotary pumpCoating chamberHigh pressure gas(49)−

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