National Institute of Advanced Industrial Science and Technology (AIST)
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AIST TODAYNo.39 2011-1 [ PDF:9.4MB ]


A perpendicularly magnetized TMR element enabling the increase of the capacity of Spin-RAMs (MRAMs)
- Design of Spin-RAMs of 5-Gbit or more is feasible -

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We have developed a high-performance perpendicularly magnetized TMR element that functions as a memory cell for large-capacity Spin-RAMs. In order to develop a large-capacity Spin-RAM with a memory capacity of over 1 Gbit, it is necessary to develop a perpendicularly magnetized TMR element that has not only a magnetoresistance (MR) ratio higher than 50 % to generate a large output signal, but also low resistance-area (RA) product of less than 30 Ωµm2 for impedance matching with peripheral circuits. However, there have been no reports on such perpendicularly magnetized TMR elements. The perpendicularly magnetized TMR element developed at AIST has succeeded in achieving an MR ratio as high as 85 % in a low-RA product region as low as about 4 Ωµm2. This technology enables the circuit design of large-capacity Spin-RAMs of 5 Gbit or more.

Figure
Electron microscope image of a cross-section of the perpendicularly magnetized TMR element developed (left), and a schematic of the cross-sectional structure (right)
The development of ultra-thin film planarization technology and a high spin-polarization inducing interfacial layer has led to success in achieving both a very low RA product and a high MR ratio.

Relational Information
AIST TODAY Vol.10 No.11 p.14 (2010)


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