National Institute of Advanced Industrial Science and Technology (AIST)
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AIST TODAYNo.21 Summer 2006 [ PDF:4MB ]


A double-gate MOSFET with an ultrafine upstanding Si-fin


We have developed a damage-free neutral-beam etching technology for the fabrication of Si-MOSFETs. A double-gate MOSFET with an upstanding Si-fin was fabricated using the technology. The MOSFET showed improved performance. We expect that this technology will be widely used in the 32nm technology node.

Figure1
Figure2
Figure 1: SEM image of the fabricated double-gate MOSFET.
Figure 2: TEM cross-sectional image of the upstanding Si-Fin.

Relational Information

AIST TODAY Vol.6 , No.4 (2005) p.28-29



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