AIST developed a novel process for ceramic forming in collaboration with NGK Insulators Ltd. In the process, less than half amount of organic binder was required compared to the conventional processes. A monolayer of organic binder, which is chemically bonded to surfaces of ceramic particles, was formed. The monolayer acts as a bridge for merging of whole particle assembly. The efficient monolayer use of organic binder reduces the amount of binder utilized, while providing strong bonding between particles due to chemical reactions.