A ferroelectric-gate field-effect transistor (FeFET) of a self-aligned-gate type has been fabricated. It has been demonstrated that an ON/OFF drain current ratio larger than 105 was held for 16 days after data writing. The success in this self-aligned-gate type means possible downsizing of FeFETs, which is indispensable for large-scale integration of non-volatile memory to the next generation. The development of one-transistor type FeRAMs and non-volatile logic integrated circuits will be accelerated.


