The National Institute of Advanced Industrial Science and Technology (AIST) in collaboration with Fujitsu Limited and Fujitsu Laboratories Ltd., have developed the world's first technologies that enable the formation and multi-layering at room temperature of ceramic film with dielectric constant of 400, on resin circuit boards. The new technologies, named as Aerosol Deposition, makes it possible to embed passive components such as condensers into printed circuit boards, such as FR4 resin circuit boards, thereby achieving miniaturization and cost reductions of circuit boards.