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AIST TODAYNo.13 Summer 2004


SiC Epitaxial Wafer for Ppower Devices in next Generation

Kazutoshi KOJIMA
Power Electronics Research Center
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4H-SiC homoepitaxial growth was carried out on low off angled 4H-SiC substrate. By using (0001) substrate, homoepitaxial layer was successfully grown on 2-inch 4H-SiC substrate with 0.5º off angle. The grown homoepitaxal layer showed an atomically flat surface morphology and crystal homogeneity without near wafer edge. This result solves problems on SiC power devices due to a large off angle of the epitaxial wafer.

Figure
The surface morphology of a epitaxial layer grown on a 2-inch substrate.
(a) Nomarski image of whole 2-inch wafer. The surface morphology of the center and edge of the wafer is enlarged in this Figure. (b) AFM image of the epitaxial layer surface obtained at the center of the wafer.

Relational Information

AIST Today Vol. 4, No.5 (2004)7



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