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Japan Fine Ceramics Center
Frontier Carbon Technology Project
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1. Background
@Diamond semiconductor is an ultimate solid state device material for high frequency modulation and high power handling due to its high breakdown field (1 x 107 V/cm), high saturation velocity (2 x 107 cm/s), low dielectric constant (5.7), and high thermal conductivity (20 W/cm-K at room temperature). Growth of single crystal diamond films thus has been an important research subject since thin films of this material were successfully obtained by chemical vapor deposition (CVD).
2. Outline of the results
@The substrate was prepared by depositing platinum by sputtering at 600 on mirror-polished sapphire(0001) surface. It was found that the full-width at half-maximum (FWHM) values of the Pt(V) X-ray diffraction rocking curve are approximately 0.16. On the Pt (111)/sapphire(0001) substrates diamond films were grown at 875 from a gas mixture of CH4 and H2 by microwave plasma CVD. (The structure of the sample is illustrated in Figure 1.)
3. Future prospects @Future goals will be to eliminate the grain boundaries in the diamond films by improving the growth process. As large-sized CVD system and growth process conditions are being developed in the present project, it would be possible to produce single crystal diamond wafers in the future. That will open a path toward application of diamond for various electronic devices including ultraviolet light emitting diodes and high-power high-frequency transistors.
Figure l: cross section structure of the sample
![]() Figure 2: surface photograph of heteroepitaxially grown diamond |